人類社會邁向電腦時代

1946年：電子計算機的發明

                2/14/1946 ENIAC誕生 "電子數值積分和計算機" 有17468支電子管 7200二極管 70000多電阻器..................

1947年：晶體管(Transister)的發明

'You've got to find what you love,' Jobs says

Animation Studios, on June 12, 2005. This is a prepared text of the Commencement address delivered by Steve Jobs, CEO of Apple Computer and of Pixar

I am honored to be with you today at your commencement from one of the finest universities in the world. I never graduated from college. Truth be told, this is the closest I've ever gotten to a college graduation. Today I want to tell you three stories from my life. That's it. No big deal. Just three stories.

The first story is about connecting the dots.

I dropped out of Reed College after the first 6 months, but then stayed around as a drop-in for another 18 months or so before I really quit. So why did I drop out?

Sievert，得名於瑞典生物物理學家Rolf Maximilian Sievert。

Sievert（中譯西弗，Sv）為物理計量的單位，用來衡量輻射對生物組織的傷害。

定義為 1 Sievert = 1 焦耳/公斤（1 Sv = 1 J/kg）

1 Sv = 1000 mSv (毫西弗)

1毫西弗=1000微西弗

B/B 值,半導體設備產業景氣的先行指標

B/B (Book to Bill Ratio) 是依據北美半導體設備製造商（North American Semicondutor Equipment Industry)過去三個月平均訂單金額與出貨金額的比值.

一般將B/B 值是否 > １,來判斷半導體市場復甦否.

但B/B > １,金額與往年相比,卻處在相對低點,不能說半導體市場已全然復甦,只能表示半導體製造商正逐漸增加設備投資.

IC製造流程:

IC的製造流程,最初來自IC設計(IC Design),再經過晶片的製造,將IC的電路佈局圖轉印於平坦的玻璃表面上,而這塊玻璃就是光罩(Photo Mask),光罩完成後,再運用微影成像的技術,以光阻劑等化學品將光罩上極細的線路圖一層層複製在矽晶圓上,再運用硝酸等化學品清洗蝕刻,就完成晶圓(Wafer)製造.

晶圓製造完成後,先作測試(Wafer Probe),再將合格的晶片自晶圓上切割下來,再進行封裝(Packaging),是以金線連接晶片(Chip)與導線架(Lead-frame)的線路,再封裝以絕緣的陶瓷或塑膠外殼,再測試,即完成IC的製造.